Guangzhou Xianyi Electronic Technology Co., Ltd.
Manufacturer of Advanced Semiconductor Connecting Materials,Providing technical consulting service and solutions
Gold based solder has the advantages of strong corrosion resistance,low vapor and good fluidity and wettability,and has a long history of use,widely used in the fields of airtight packaging, chip packaging and so on.
Features
lStrong corrosion resistance
lLow vapor pressure
lExcellent fluidity and wettability
lSuitable for hermetic packaging
lMinimum thickness 7μm, smallest size 0.2mm*0.2mm
Products | Solidus(℃) | Liquidus(℃) | Density (g/cm3) | Resistivity (μΩ·m) | Thermal Conductivity (W/m·K) | CTE (10-6/℃) | Tensile Strength (MPa) |
Au80Sn20 | / | 280(e) | 14.52 | 0.224 | 57 | 16 | 276 |
Au88Ge12 | / | 361(e) | 14.67 | 0.151 | 44 | 13.4 | 185 |
Au96.8Si3.2 | / | 363(e) | 15.4 | / | 27 | 12 | 255 |
Au80Cu20 | / | 910(e) | 15.67 | / | / | / | / |
Applications
Chip Eutectic
Airtight Package
Metallized Fiber Welding