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Xianyi Products
Interconnecting Materials for Electronic Packaging
Solder Preforms
List of Common Solders Gold-Based Solders Silver-Based Solders Indium-Based Solders Tin-Based Solders Flux Coated Solder Preforms Packaging Solutions for Automatic Feeding
AuSn Solder Paste
Solder Balls
Solder Wire & Paste
Noble Metal Bonding Wire & Ribbon
Flux Paste
Interconnecting Devices for Electronic Packaging
AuSn Solder Seal Lids
AuSn Thin Film Heat Sinks
Electronic Packaging Materials for Third-Generation Power Semiconductor
AMB Ceramic Substrates
Nano-Ag Paste
Solder Wire & Paste

Solder Wire & Paste

A variety of solder wire (min dia 0.1mm) and paste (finest powder T7) are available to meet different demands in electronic assembly.

About us
About Us Honor & Qualification Testing Center
Products
Interconnecting Materials for Electronic Packaging Interconnecting Devices for Electronic Packaging Electronic Packaging Materials for Third-Generation Power Semiconductor
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Hotline

020-34698382

Email：info@xianyichina.com
Guangzhou Xianyi Electronic Technology Co., Ltd. Address：3/F, Building5& 6, 16 Lianyun 1st heng Road, Shiqi Town, Panyu District, Guangzhou, Guangdong, China
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