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Xianyi Products

Interconnecting Materials for Electronic Packaging

Solder Preforms

List of Common Solders Gold-Based Solders Silver-Based Solders Indium-Based Solders Tin-Based Solders Flux Coated Solder Preforms Packaging Solutions for Automatic Feeding

AuSn Solder Paste

Solder Wire & Paste

Noble Metal Bonding Wire & Ribbon

Interconnecting Devices for Electronic Packaging

AuSn Solder Seal Lids

AuSn Thin Film Heat Sinks

Electronic Packaging Materials for Third-Generation Power Semiconductor

AMB Ceramic Substrates

Noble Metal Bonding Wire & Ribbon

Noble Metal Bonding Wire & Ribbon

To meet demands in different applications, Xianyi can provide several type of noble metal bonding wire & ribbon with a minimum diameter of φ15 μm.

Features：

l Excellent sulfurization resistance

l Flexible production, one week delivery for noble metal bonding wire, two week delivery for ribbon

About us: About Us Honor & Qualification Testing Center

Products: Interconnecting Materials for Electronic Packaging Interconnecting Devices for Electronic Packaging Electronic Packaging Materials for Third-Generation Power Semiconductor

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WeChat Official Accounts

Hotline

020-34698382

Email：info@xianyichina.com

Guangzhou Xianyi Electronic Technology Co., Ltd. Address：3/F, Building5& 6, 16 Lianyun 1st heng Road, Shiqi Town, Panyu District, Guangzhou, Guangdong, China